Non-volatile memory device

ABSTRACT

According to an embodiment, a non-volatile memory device includes first electrodes stacked on an underlying layer, a second electrode provided on the first electrodes, a semiconductor layer extending in a first direction from the underlying layer to the second electrode, and a memory film provided between each of the first electrodes and the semiconductor layer. The semiconductor layer includes a first portion adjacent to the first electrodes and a second portion adjacent to the second electrode. The second portion has a thickness thinner than a thickness of the first portion in a second direction perpendicular to the first direction.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromU.S. Provisional Patent Application 62/008,343 filed on Jun. 5, 2014;the entire contents of which are incorporated herein by reference.

FIELD

Embodiments are generally related to a non-volatile memory device.

BACKGROUND

A memory cell array of three-dimensional structure has been developed torealize a next-generation non-volatile memory device. The memory cellarray of three-dimensional structure includes a plurality of stackedword lines, and memory cells formed inside a memory hole piercingthrough the word lines. Furthermore, a select gate transistor is alsoprovided in the memory hole to allow access to a specified memory cell.The select transistor preferably has the cutoff characteristic such thatthe off-current is effectively suppressed.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional view illustrating an example of anon-volatile memory device according to a first embodiment;

FIGS. 2A and 2B are schematic cross-sectional views illustrating anexample of a memory hole in a memory cell array according to the firstembodiment;

FIGS. 3A to 10 are schematic cross-sectional views illustrating anexample of a manufacturing process of the memory cell array according tothe first embodiment;

FIG. 11 is a block diagram illustrating an example of the non-volatilememory device according to the first embodiment;

FIG. 12 is a schematic cross-sectional view illustrating an example of amemory cell array according to a variation of the first embodiment;

FIG. 13 is a schematic cross-sectional view illustrating an example of amemory cell array according to a second embodiment;

FIGS. 14A to 16B are schematic cross-sectional views illustrating anexample of a manufacturing process of the memory cell array according tothe second embodiment;

FIGS. 17A and 17B are schematic cross-sectional views illustratingexamples of a memory cell array according to a variation of the secondembodiment;

FIG. 18 is a schematic cross-sectional view illustrating an example of anon-volatile memory device according to a third embodiment.

DETAILED DESCRIPTION

According to an embodiment, a non-volatile memory device includes firstelectrodes stacked on an underlying layer, a second electrode providedon the first electrodes, a semiconductor layer extending in a firstdirection from the underlying layer to the second electrode, and amemory film provided between each of the first electrodes and thesemiconductor layer. The semiconductor layer includes a first portionadjacent to the first electrodes and a second portion adjacent to thesecond electrode. The second portion has a thickness thinner than athickness of the first portion in a second direction perpendicular tothe first direction.

Embodiments will now be described with reference to the drawings. Likeportions in the drawings are labeled with like reference numerals, withthe detailed description thereof omitted appropriately, and thedifferent portions are described. The drawings are schematic orconceptual. The relationship between the thickness and the width of eachportion, and the size ratio between the portions, for example, are notnecessarily identical to those in reality. Furthermore, the same portionmay be shown with different dimensions or ratios in each figure.

In the following description, the arrangement of components is describedwith reference to three axis directions orthogonal to each other, i.e.,the X-direction, Y-direction, and Z-direction, shown in the figures. TheZ-direction may be referred to as “above”, and the opposite directionmay be referred to as “below”.

First Embodiment

FIG. 1 is a schematic sectional view showing a non-volatile memorydevice 100 according to a first embodiment. FIG. 1 is a partialsectional view showing the structure of a memory cell array 1 of thenon-volatile memory device 100.

The memory cell array 1 includes a plurality of first electrodes(hereinafter word lines 20), a second electrode (hereinafter select gate30), and a third electrode (hereinafter select gate 40). The word lines20 are stacked on an underlying layer 10. The select gate 30 is providedon the uppermost layer 20 a of the word lines 20. A conductive layer(hereinafter source layer 13) is provided between the underlying layer10 and the word lines 20. The select gate 40 is provided between thesource layer 13 and the lowermost layer 20 b of the plurality of wordlines 20.

An insulating film 23 is provided between the word lines adjacent toeach other in the Z-direction. The insulating film 23 is provided alsobetween the word line 20 and the select gate 30, between the word line20 and the select gate 40, and between the source layer 13 and theselect gate 40. The insulating film 23 electrically insulates the wordlines 20, the select gates 30, 40, and the source layer 13 from eachother.

The memory cell array 1 further includes a semiconductor layer 50 and amemory film 55 extending in a first direction (Z-direction) from theunderlying layer 10 toward the select gate 30. The semiconductor layer50 is provided so as to pierce in the Z-direction through the selectgate 40, the word lines 20, and the select gate 30. The memory film 55is provided at least between each word line 20 and the semiconductorlayer 50. The memory film 55 can extend between the semiconductor layer50 and the select gate 30, and between the semiconductor layer 50 andthe select gate 40.

Specifically, the memory film 55 is provided to cover the inner wall ofa memory hole 70 piercing through the word lines 20 and the select gates30 and 40. The semiconductor layer 50 is provided on the memory film 55,and covers the wall surface and the bottom surface 70 a of the memoryhole 70. The semiconductor layer 50 is electrically connected to thesource layer 13 at the bottom surface 70 a of the memory hole 70.

Furthermore, a core layer 60 is provided inside the memory hole 70. Thecore layer 60 is an insulator. The core layer 60 may be made of amaterial different from that of the insulating film 23, for example. Thesemiconductor layer 50 is provided between the core layer 60 and theword line 20. Furthermore, the semiconductor layer 50 is providedbetween the core layer 60 and the select gate 30 and between the corelayer 60 and the select gate 40.

The memory cell array 1 includes a plurality of memory cells MC arrangedin the Z-direction. The memory cell MC includes part of the memory film55 and is provided between the word line 20 and the semiconductor layer50. The memory cells MC are arranged in the extending direction of thesemiconductor layer 50 (Z-direction). The number of memory cellsprovided inside a memory hole 70 is equal to the stacked number of theword lines 20.

The memory film 55 extends in the Z-direction. The memory film 55 is anelectrical insulator, and serves as a gate insulating film.

The memory cell array 1 includes select transistors ST1 and ST2. In theselect transistor ST1, the semiconductor layer 50 serves as a channel,and the select gate 30 serves as a gate electrode. In the selecttransistor ST2, the semiconductor layer 50 serves as a channel, and theselect gate 40 serves as a gate electrode.

The memory cell array 1 includes a wiring (hereinafter bit line 80)provided via an interlayer insulating film 25 on the select gate 30. Thebit line 80 is electrically connected to the upper end of thesemiconductor layer 50. The semiconductor layer 50 includes a portion 50e provided between the source layer 13 and the core layer 60 at thebottom surface 70 a of the memory hole 70, and is electrically connectedto the source layer 13.

The memory cell array 1 includes a memory string provided inside thememory hole 70. The memory string includes a pair of select transistorsST1, ST2 provided on the semiconductor layer 50 and a plurality ofmemory cells MC arranged between the select transistors ST1 and ST2. Oneend of the semiconductor layer 50 is electrically connected to thesource layer 13, and the other end is electrically connected to the bitline 80.

The select gate 30 and the select gate 40 are provided to be thickerthan each word line 20 in the Z-direction. This may reduce theoff-current of the select transistors ST1 and ST2.

The semiconductor layer 50 includes a portion in which the memory cellsMC are formed (hereinafter a memory channel portion 50 a), and a portionin which the select gate 30 is formed (hereinafter a gate channelportion 50 b). In other words, the semiconductor layer 50 includes aportion piercing through the word lines 20 (i.e. the memory channelportion 50 a) and a portion piercing through the select gate 30 (i.e.the gate channel portion 50 b). The thickness of the gate channelportion 50 b is thinner than the thickness of the memory channel portion50 a. In other words, the thickness of the gate channel portion 50 b isthinner than the thickness of the thinnest part of memory channelportion 50 a. This may further suppress the off-current of the selecttransistor ST1, and improve the cutoff characteristic thereof.

FIGS. 2A and 2B are schematic sectional views illustrating the memoryhole 70 of the memory cell array 1 according to the first embodiment.FIG. 2A is a sectional view taken along line 2A-2A shown in FIG. 1. FIG.2B is a sectional view taken along line 2B-2B shown in FIG. 1.

As shown in FIG. 2A, the memory hole 70 has e.g. a circular crosssection in the X-Y plane. The memory film 55 and the gate channelportion 50 b are stacked on the inner surface of the memory hole 70piercing through the select gate 30. For example, a gate bias is appliedto the gate channel portion 50 b such that the select gate 30 is placedat a negative potential. Then, a depletion layer DL is formed inside thegate channel portion 50 b. At this time, the select transistor ST1 isturned off, and blocks electrical continuity between the bit line 80 andthe semiconductor layer 50 on the memory cell MC side.

For example, the number of carrier trap levels included in the gatechannel portion 50 b can be decreased by narrowing the width W_(G) ofthe gate channel portion 50 b. This can reduce the channel leakagecurrent flowing via the trap levels. Furthermore, the width of thenon-depleted region NDL can be narrowed by narrowing the width of thegate channel portion 50 b. This also contributes to the reduction of thechannel leakage current. As a result, by narrowing the width W_(G) ofthe gate channel portion 50 b, the channel leakage current of the selecttransistor ST1 can be reduced, and its cutoff characteristics can beimproved.

As shown in FIG. 2B, the memory film 55 and the memory channel portion50 a are stacked on the inner surface of the memory hole 70 penetratingthrough the word line 20. The width W_(M) of the memory channel portion50 a is wider than the width W_(G) of the gate channel portion 50 b.This can decrease the resistance of the semiconductor layer 50 andincrease the current flowing in the memory channel portion 50 a. Thatis, in this embodiment, the cutoff characteristics of the selecttransistor ST1 can be improved while maintaining the current flowing inthe memory channel portion 50 a. This can prevent e.g. data misread.

Next, a method for manufacturing the non-volatile memory device 100according to the first embodiment is described with reference to FIGS.3A to 10. FIGS. 3A to 10 are schematic sectional views showing anexample of the process for manufacturing the memory cell array 1.

As shown in FIG. 3A, an insulating film 23 and a conductive layer 15 areformed in this order on a source layer 13. Conductive layers 17 andinsulating films 23 are alternately stacked on the conductive layer 15.The number of stacked conductive layers 17 is equal to the number ofmemory cells MC arranged in the Z-direction. A conductive layer 19 isformed on the uppermost insulating film 23. As a result, the pluralityof conductive layers 17 are stacked in the Z-direction via theinsulating films 23.

The source layer 13 is formed on an underlying layer 10, not shown. Theunderlying layer is e.g. an interlayer insulating film formed on awafer. The source layer 13 may be formed in an insulating substrate. Inthis case, the underlying layer 10 is the insulating substrate. Theconductive layers 15, 17, and 19 are e.g. conductive polycrystallinesilicon (polysilicon) films. The insulating film 23 is e.g. a siliconoxide film. The source layer 13 may be formed by diffusing impurity andthe like in a semiconductor substrate.

Next, the conductive layers 15, 17, and 19 are patterned into stripesextending in the Y-direction to form a plurality of stacked bodies 130(see FIG. 11). As a result, the conductive layers 15, 17, and 19 can beprocessed to form a select gate 40, word lines 20, and a select gate 30.Next, as shown in FIG. 3B, an interlayer insulating film 25 is formed soas to cover the stacked bodies 130. As a result, the interlayerinsulating film covers the select gate 40, the word lines 20, and theselect gate 30. The interlayer insulating film 25 is e.g. a siliconoxide film.

In this specification, “to cover” is not limited to the case where “whatcovers” is in direct contact with “what is covered”, but also includesthe case where “what covers” covers “what is covered” via anotherelement.

As shown in FIG. 4A, a memory hole 70 is formed. For example, a throughhole extending from the upper surface of the interlayer insulating film25 to the source layer 13 is formed by RIE (reactive ion etching). Forexample, the memory hole 70 pierces in the Z-direction through theselect gate 40, the plurality of word lines 20, and the select gate 30.

As shown in FIG. 4B, a memory film 55 covering the inner wall of thememory hole 70 is formed. The memory film 55 is e.g. a stacked filmincluding a silicon oxide film and a silicon nitride film. For example,a silicon oxide film covering the inner surface of the memory hole 70and the upper surface of the interlayer insulating film 25 is formed byCVD (chemical vapor deposition). Next, a silicon nitride film is formedon the silicon oxide film. Furthermore, another silicon oxide film isformed on the silicon nitride film. The memory film 55 has e.g. athree-layer structure of silicon oxide film/silicon nitride film/siliconoxide film. The memory film 55 is formed conformally on the inner wallof the memory hole 70.

As shown in FIG. 5A, the memory film 55 formed on the bottom surface 70a of the memory hole 70 is selectively removed. For example, the memoryfilm 55 formed on the bottom surface 70 a is selectively removed byanisotropic RIE, and the portion formed on the wall surface of thememory hole 70 is left. As a result, the source layer 13 is exposed fromthe bottom surface 70 a of the memory hole 70. The memory film 55 formedon the upper surface of the interlayer insulating film 25 is alsoremoved.

As shown in FIG. 5B, a semiconductor layer 50 covering the inner surfaceof the memory hole 70 and the interlayer insulating film 25 is formed.The semiconductor layer 50 is e.g. a polysilicon layer formed by CVD.The semiconductor layer 50 includes e.g. n-type impurity. Thesemiconductor layer 50 is in contact with the source layer 13 exposed atthe bottom surface 70 a of the memory hole 70. As a result, thesemiconductor layer 50 is electrically connected to the source layer 13.

Next, an insulating film 57 filling the inside of the memory hole 70 isformed. The insulating film 57 is formed also on the interlayerinsulating film 25. The insulating film 57 is preferably made of e.g. amaterial that can be selectively removed relative to the select gate 30,the word line 20, the insulating film 23, and the interlayer insulatingfilm 25. The insulating film 57 is e.g. a silicon nitride film.

As shown in FIG. 6A, the insulating film 57 is etched back to expose thesemiconductor layer 50 formed on the interlayer insulating film 25. Theinsulating film 57 is left inside the memory hole 70. The upper surface57 a of the insulating film 57 is located above the upper surface of theselect gate 30. The upper surface 57 a of the insulating film 57 can belocated between the upper surface 30 a of the select gate 30 and theupper surface 25 a of the interlayer insulating film 25.

As shown in FIG. 6B, the semiconductor layer 50 exposed above theinsulating film 57 is removed by etching. Subsequently, the insulatingfilm 57 is further etched back to make the upper surface 57 a of theinsulating film 57 lower than the lower surface of the select gate 30.At this time, the upper surface 57 a of the insulating film 57 can belocated between the select gate 30 and the uppermost layer 20 a of theword lines 20. As a result, the gate channel portion 50 b is exposed,which faces the select gates 30 across the memory film 55. In thefollowing description, the insulating film 57 left inside the memoryhole 70 is referred to as a core layer 60.

As shown in FIG. 7, the gate channel portion 50 b exposed at the wallsurface of the memory hole 70 is etched, and thinned. For example, thegate channel portion 50 b is thermally oxidized to form a silicon oxidefilm on the surface. Subsequently, the silicon oxide film is selectivelyremoved with e.g. an etching liquid based on hydrofluoric acid. Thus,the film thickness of the gate channel portion 50 b is made thinner thanthat of the memory channel portion 50 a. The thinning method of the gatechannel portion 50 b is not limited to the one based on thermaloxidation, but an isotropic dry etching may be used therefor. Thethermal oxidation may be repeatedly performed.

The memory channel portion 50 a is a portion located between the corelayer 60 and each word line 20. For example, the gate channel portion 50b is formed to be thinner than any part of the memory channel portion 50a in the X-direction.

As shown in FIG. 8, an insulating film 58 is formed to fill the upperpart of the memory hole 70. The insulating film 58 is formed also on theinterlayer insulating film 25. The insulating film 58 is made of amaterial that can be selectively etched against the interlayerinsulating film 25. The insulating film 58 is e.g. a silicon nitridefilm. In the case where the insulating film 58 is made of the samematerial as the core layer 60, for example, the insulating film 58 isintegrated with the core layer 60.

As shown in FIG. 9, the insulating film 58 (core layer 60) is etchedback to make the upper surface 60 u of the core layer 60 lower than theupper end 50 f of the semiconductor layer 50. For example, the uppersurface 60 u of the core layer 60 is located between the upper surface30 a of the select gate 30 and the upper end 50 f of the semiconductorlayer 50 in the Z-direction. As a result, the upper end 50 f of thesemiconductor layer 50 is exposed from the core layer 60.

As shown in FIG. 10, a conductive film 80 a is formed on the interlayerinsulating film 25. Subsequently, the conductive film 80 is separatedinto wirings (see FIG. 11) extending in the X-direction to form bitlines 80. Thus, a memory cell array 1 is completed. The bit line 80includes e.g. a portion extending inside the memory hole 70 and being incontact with the upper end 50 f of the semiconductor layer 50. The bitline 80 is e.g. a polysilicon film doped with p-type impurity.

FIG. 11 is a block diagram showing an example of the non-volatile memorydevice 100 according to the first embodiment. The non-volatile memorydevice 100 includes e.g. a memory cell array 1, a row decoder 101, asense amplifier 103, a control circuit 105, and an interface 107. Thecontrol circuit 105 controls the row decoder 101 and the sense amplifier103 to record data in the memory cells MC and to read the data from thememory cells MC based on the instruction obtained from outside throughthe interface 107.

As shown in FIG. 11, the memory cell array 1 includes a plurality ofstacked bodies 130. Each stacked body 130 includes lines 20 and selectgates 30, 40. As viewed in the Z-direction, the stacked body 130 isprovided in e.g. a rectangular shape extending in the Y-direction. Thestacked bodies 130 are arranged in the X-direction. Each stacked body130 includes memory holes 70.

The row decoder 101 is connected to each of word line 20, the selectgate 30, and the select gate 40, and applies voltages thereto. The senseamplifier 103 is connected to the bit lines 80 and the source layer 13.The sense amplifier 103 applies a voltage between the source layer 13and the bit line 80 and detects the current flowing therebetween. Thus,the sense amplifier 103 reads the data from the memory cell.Furthermore, the sense amplifier 103 determines the data read from thememory cell MC and temporarily store the data.

The bit line 80 extends in e.g. the X-direction and is electricallyconnected to a semiconductor layer provided in one of the memory holesin each stacked body 130. The control circuit 105 may access one memorycell MC by selecting one word line 20 through the row decoder 101 andselecting one bit line 80 through the sense amplifier 103.

Next, the operation of the memory cell array 1 is described withreference to Table 1. Table 1 shows the voltages applied to each of thebit line BL, the select gates SGD, SGS, the word lines WL, and thesource layer SL, and their relations to the operation mode. Here, theselect gate SGD corresponds to the select gate 30, and the select gateSGS corresponds to the select gate 40.

TABLE 1 Read Write “0” Write “1” Erase(selected) Erase(non-selected) BLVbl 0 Vdd Verase Verase SGD Vdd Vdd Vdd Vera del Vera del WL4 VreadVpass Vpass 0 open WL3 0 Vprog Vprog 0 open WL2 Vread Vpass Vpass 0 openWL1 Vread Vpass Vpass 0 open SGS Vdd Voff Voff Vera del Vera del SL 0Vdd Vdd open open(Read Operation)

For example, a voltage of 0.7 V is applied to the selected bit line BL,and a voltage of 0 V is applied to the source layer SL at the time ofreading data from the selected memory cell MC1. A voltage of Vdd (e.g.,3.0 V) is applied to the select gates SGD and SGS in the stacked body130 that includes the selected memory cell MC1, and turns on the selecttransistors ST1 and ST2. The select transistors ST1 and ST2 in the otherstacked bodies 130 are maintained in the off-state.

Next, the word line WL including the selected memory cell MC1 is set to0 V, and Vread (e.g., 4.5 V) is applied to the other word lines WL.Thus, a current corresponding to the threshold voltage Vth of theselected memory cell MC1 flows between the bit line BL and the sourcelayer SL. The sense amplifier 103 may read data stored in the selectedmemory cell MC by detecting this current.

(Write Operation)

In the case of writing data “0” in the memory cell MC1, for example,electrons are injected into the memory film 55 of the selected memorycell MC1, and increase the threshold voltage thereof, i.e. the injectedelectrons shift the threshold value to the positive direction. In thiscase, the voltage of 0V is applied to the selected bit line BL; Vdd(e.g., 3.0 V) is applied to the source layer SL and the select gate SGDin the stacked body 130 that includes the selected memory cell MC1; andVoff (e.g., 0 V) is applied to the select gate SGS. Thus, the selecttransistor ST1 is turned on, and the select transistor ST2 is turnedoff. The semiconductor layer 50 is biased at equipotential (0 V) to thebit line BL.

Here, the bit line BL is biased at 0 V, and the gate electrode of theselect transistor ST1 is biased at Vdd. On the other hand, the sourcelayer SL is biased Vdd, and the gate electrode of the select transistorST2 is biased at 0 V. Thus, it is preferable that the select transistorST1 have smaller off leakage than the select transistor ST2.Accordingly, it is preferable to reduce the channel leak current in theselect transistor ST1 by narrowing the width W_(G) of the gate channelportion 50 b.

On the other hand, in the read operation, a large current may be passedin the memory string. In this case, the width of the channel portion ispreferably wider in the select transistor ST2. Thus, the characteristicscan be improved at the read time by making the width of the channelportion of the select transistor ST2 wider than the width W_(G) of thegate channel portion 50 b.

The word line WL that includes the selected memory cell MC1 is biased atVprog (e.g., 18 V), and the other word lines WL are biased at Vpass(e.g., 10 V). Thus, electrons are injected from the semiconductor layer50 into the memory film 55 in the selected memory cell MC1. Accordingly,the threshold voltage of the selected memory cell MC1 is shifted to thepositive direction.

In the case of writing data “1” in the memory cell MC1, for example, thethreshold of the memory cell MC1 is maintained at the level of the erasetime, i.e. no electron is injected into the charge stored layer. In thiscase, the selected bit line BL is biased at Vdd. This makes the gatepotential of the select transistor ST1 equal to the source potentialthereof. Thus, the select transistor ST1 is turned off. As a result, thepotential difference decreases between the memory channel portion 50 aand the word line WL in the memory cell MC1. Thus, no injection ofelectron into the memory film 55 occurs in the memory cell MC1.

(Erase Operation)

The data erase operation is performed in units of memory blocks eachincluding a plurality of memory strings. For example, the bit line isbiased at Verase (e.g. 20 V), and the source layer SL is held at afloating voltage. Next, the potential of the select gates SGS and SGD isincreased to Verase_del (e.g. 15 V), for example. This generates a GIDLcurrent (gate induced drain leak current) near the gate end of theselect transistor ST1, and holes generated therein move to the memorychannel portion 50 a. Thus, the potential of the memory channel portion50 a comes closer to Verase. Next, the potential of all the word linesWL in the selected memory block is set to e.g. 0 V. Then, electrons areextracted from the memory film 55. This erases the data stored in thememory cells MC in the memory block.

During this time, the potential of all the word lines WL in thenon-selected memory block is held at a floating voltage. Since the wordline WL is capacitively coupled to the memory channel portion 50 a, thepotential of the word lines WL increases as the potential increases inthe memory channel portion 50 a. As a result, the potential differencebetween the word line WL and the memory channel portion 50 a comescloser to 0. Thus, no electrons are extracted from the memory film 55.That is, the data is not erased in the memory cells MC.

The control circuit 105 receives the instruction from outside throughthe interface 107, and provides commands based thereon to the rowdecoder 101 and the sense amplifier 103 for implementing theaforementioned operations.

FIG. 12 is a schematic sectional view showing a memory cell array 2according to a variation of the first embodiment. The select gate 30 ofthe memory cell array 2 includes a plurality of sublayers 31, 33, and 35stacked sequentially in the Z-direction. The number of sublayersincluded in the select gate 30 is not limited to this example, but maybe e.g. two, or four or more.

An insulating film 23 is formed between the sublayer 31 and the sublayer33 and between the sublayer 33 and the sublayer 35. The insulating film23 is, for example, a silicon oxide film. The sublayers 31, 33, and 35are electrically connected to each other in a portion not shown, forexample.

The semiconductor layer 50 includes a gate channel portion 50 b incontact with the sublayers 31, 33, and 35 via the memory film 55. Inother words, the semiconductor layer 50 includes a gate channel portion50 b opposed to the sublayers 31, 33, and 35 across the memory film 55.

The thickness of the gate channel portion 50 b in the directionorthogonal to the Z-direction is thinner than e.g. the thickness of thememory channel portion 50 a in the direction orthogonal to theZ-direction. The gate channel portion 50 b may have a portion thinnerthan any part of the memory channel portion 50 a, in which thesemiconductor layer 50 pierces through any one of the sublayers 31, 33,and 35.

Also in the memory cell array 2, the channel leakage current of theselect transistor ST1 may also be suppressed to improve its cutoffcharacteristics while maintaining the value of the current flowing inthe memory channel portion 50 a. This may suppress an access failure tothe memory cell MC.

Second Embodiment

FIG. 13 is a schematic sectional view showing a memory cell array 3according to a second embodiment.

The memory cell array 3 includes a plurality of word lines 20, a selectgate 30, and a select gate 40. The word lines 20 are stacked on anunderlying layer 10 (not shown). The select gate 30 is provided on theuppermost layer 20 a of the word lines 20. A conductive layer(hereinafter source layer 13) is provided between the underlying layer10 and the word lines 20. The select gate 40 is provided between thesource layer 13 and the lowermost layer 20 b of the word lines 20. Thesource layer 13, the word lines 20, and the select gates 30 and 40 areelectrically insulated from each other via an insulating film 23.

The memory cell array 3 further includes a semiconductor layer 50 and amemory film 55 extending in the Z-direction. The semiconductor layer 50extends in the Z-direction so as to pierce through the select gate 40,the plurality of word lines 20, and the insulating film 23. The memoryfilm 55 is provided at least between each of the word lines 20 and thesemiconductor layer 50. The memory film 55 may extend between the selectgate 40 and the semiconductor layer 50.

The memory cell array 3 further includes a second semiconductor layer(hereinafter semiconductor layer 90) extending in the Z-direction so asto pierce through the select gate 30. The semiconductor layer 90 iselectrically connected to the semiconductor layer 50. For example, thesemiconductor layer 90 is made of a material in which a density ofcarrier trap level is lower than that in the semiconductor layer 50. Thesemiconductor layer 90 is, for example, an oxide semiconductor. Forexample, the semiconductor layer 90 is provided so that the thicknessthereof in the direction orthogonal to the Z-direction is smaller thanthe thickness of the semiconductor layer 50 in the direction orthogonalto the Z-direction.

For example, the memory film 55 is provided to cover the inner wall of amemory hole 70 piercing through the word lines 20, the insulating film23, and the select gates 30 and 40. The semiconductor layer 50 isprovided to cover the bottom surface 70 a of the memory hole 70 and thelower part of the memory film 55. The semiconductor layer 50 is incontact with the source layer 13 in the portion 50 e covering the bottomsurface 70 a of the memory hole 70, and electrically connected to thesource layer 13. The semiconductor layer 90 covers the upper part of thememory film 55. The semiconductor layer 90 is electrically connected tothe bit line 80. The bit line 80 is provided on the select gate 30 viaan interlayer insulating film 25.

A core layer 60 a and a core layer 60 b are provided inside the memoryhole 70. The core layers 60 a and 60 b are insulators. The core layers60 a and 60 b may be different in material from the insulating film 23,for example. The semiconductor layer 50 is provided between the corelayer 60 a and the word line 20. Furthermore, the semiconductor layer 50is provided between the core layer 60 a and the select gate 40. Thesemiconductor layer 90 is provided between the core layer 60 b and theselect gate 30. Furthermore, the semiconductor layer 90 may include aportion provided between the core layer 60 a and the core layer 60 b.

The memory film 55 is provided between each word line 20 and thesemiconductor layer 50. The memory film 55 may extend between thesemiconductor layer 50 and the select gate 40. Furthermore, the memoryfilm 55 may extend between the semiconductor layer 90 and the selectgate 30.

The memory cell array 3 includes a plurality of memory cells MC arrangedin the Z-direction, a select transistor ST1, and a select transistorST2. The select transistors ST1 and ST2 are disposed on both sides ofthe memory cells MC arranged in the Z-direction. The memory cell MCincludes part of the memory film 55 and is located between the word line20 and the semiconductor layer 50. In the select transistor ST1, theportion of the semiconductor layer 90 piercing through the select gate30 serves as a channel portion (hereinafter gate channel portion 90 a),and the select gate 30 serves as a gate electrode. In the selecttransistor ST2, the portion of the semiconductor layer 50 piercingthrough the select gate 40 serves as a channel portion, and the selectgate 40 serves as a gate electrode. The memory film 55 acts as a gateinsulating film of the select transistors ST1 and ST2.

Next, a method for manufacturing the memory cell array 3 according tothe second embodiment is described with reference to FIGS. 14A to 16B.FIGS. 14A to 16B are schematic sectional views showing the manufacturingprocess of the memory cell array 3.

As shown in FIG. 14A, a semiconductor layer 50, a memory film 55, and acore layer 60 a are formed inside a memory hole 70. The memory film 55covers the inner wall of the memory hole 70. The semiconductor layer 50is formed to cover the memory film 55 and a source layer 13 exposed atthe bottom surface 70 a of the memory hole 70. The core layer 60 a isprovided on the semiconductor layer 50 and fills the memory hole 70.

As shown in FIG. 14A, the upper surface 60 u of the core layer 60 a andthe upper end 50 f of the semiconductor layer 50 are located between theuppermost layer 20 u of the word lines 20 and the select gate 30 in theZ-direction. Such a structure can be formed by removing the gate channelportion 50 b exposed from the core layer 60 a in the step shown in FIG.7, for example.

As shown in FIG. 14B, a semiconductor layer 90 is formed so as to coverthe inner surface of the memory hole 70 and the upper surface of theinterlayer insulating film 25. The semiconductor layer 90 is provided onthe upper surface 60 u of the core layer 60 a, the upper end 50 f of thesemiconductor layer 50, and the portion 55 a of the memory film 55 whichcovers the select gate 30 inside the memory hole 70.

The semiconductor layer 90 is, for example, an oxide semiconductor, andmay be formed by reactive sputtering. Alternatively, the semiconductorlayer 90 may be a polysilicon layer. The semiconductor layer 90 is madeof IGZO (indium gallium zinc oxide), for example. For example, thesemiconductor layer 90 may have a lower electron trap level density thanthe semiconductor layer 50 of polysilicon. The semiconductor layer 90 ispreferably formed to be thinner than the semiconductor layer 50.

As shown in FIG. 15A, an insulating film 59 is formed to fill the upperpart of the memory hole 70. The insulating film 59 is formed also on theinterlayer insulating film 25. For example, the insulating film 59 ismade of a material that is capable of selectively etching against theinterlayer insulating film 25 and the semiconductor layer 90. Theinsulating film 59 is, for example, a silicon nitride film.

As shown in FIG. 15B, the insulating film 59 is etched back to form acore layer 60 b inside the memory hole 70. The semiconductor layer 90 isexposed on the interlayer insulating film 25.

As shown in FIG. 16A, the portion of the semiconductor layer 90 on theinterlayer insulating film 25 is removed by etching. Next, as shown inFIG. 16B, a bit line 80 is formed on the interlayer insulating film 25and the core layer 60 b to complete a memory cell array 3. The bit line80 is in contact with the semiconductor layer 90 exposed between thecore layer 60 b and the interlayer insulating film 25, and electricallyconnected to the semiconductor layer 90.

In the embodiment, the semiconductor layer 90 is used as the gatechannel portion 90 a of the select transistor ST1 to suppress itschannel leak current. For example, the thickness of the semiconductorlayer 90 is formed to be thinner than the thickness of the semiconductorlayer 50 in the direction orthogonal to the Z-direction. Thus, thecutoff characteristics of the select transistor ST1 may be improvedwhile maintaining the current flowing through the semiconductor layer50.

FIG. 17A is a schematic sectional view showing a memory cell array 4according to a variation of the second embodiment. The memory cell array4 includes a memory hole 70 piercing through a plurality of word lines20, an insulating film 23, and select gates 30 and 40. The memory cellarray 4 includes a semiconductor layer 50, a semiconductor layer 90, anda core layer 60 b inside the memory hole 70.

The semiconductor layer 50 is provided to fill the lower part of thememory hole 70. A memory film 55 is provided between the semiconductorlayer 50 and each of the word lines 20. The memory film 55 extendsbetween the semiconductor layer 50 and the select gate 40. The uppersurface 50 g of the semiconductor layer 50 is located between theuppermost layer 20 a of the word lines 20 and the select gate 30. Thismay decrease the resistance of the semiconductor layer 50 and increasethe current flowing in the semiconductor layer 50.

A semiconductor layer 90 is provided on the semiconductor layer 50inside the memory hole 70. The semiconductor layer 90 is provided tocover the upper surface 50 g of the semiconductor layer 50 and the uppersidewall of the memory hole 70. The core layer 60 b is provided on thesemiconductor layer 90 and fills the upper part of the memory hole 70.As a result, the core layer 60 b is provided so as to pierce through theselect gate 30.

The semiconductor layer 90 is provided between the select gate 30 and acore layer 60 a. The semiconductor layer 90 includes a portion locatedbetween the semiconductor layer 50 and the core layer 60 b. The memoryfilm 55 extends between the select gate 30 and the semiconductor layer90.

The carrier trap level density in the semiconductor layer 90 is lowerthan the carrier trap level density in the semiconductor layer 50. Thesemiconductor layer 50 is made of polysilicon, for example. Thesemiconductor layer 90 is, for example, an oxide semiconductor.

The gate channel portion 90 a of the select transistor ST1 is made of asemiconductor that has a lower carrier trap level density than thememory channel portion 50 a. This makes it possible to suppress thechannel leak current of the select transistor ST1, and improve thecutoff characteristics of the select transistor ST1.

FIG. 17B is a schematic sectional view showing a memory cell array 5according to another variation of the second embodiment. A gateinsulating film 55 a is formed between the select gate 30 and the gatechannel portion 90 a. Here, the gate insulating film 55 a is, forexample, a single layer of silicon oxide, or a silicon oxide film thatcontains nitrogen. The lower surface of the gate insulating film 55 a isin contact with the upper surface of the memory film 55. The lowersurface of the gate insulating film 55 a is located at the same level asthe lower surface of the semiconductor layer 90. Thus, it is possible toprevent the select transistor ST1 from the variation in the thresholdvoltage by using the gate insulating film 55 a in the select transistorST1.

The structure shown in FIG. 17B is formed, for example, by completelyremoving the memory film 55 exposed from the core layer 60 a and thenforming a gate insulating film 55 a in the manufacturing step of FIG.14A.

Although referring to the semiconductor layer 90 in the embodimentdescribed above as a layer with the carrier trap level density lowerthan that in the semiconductor layer 50, the embodiment is not limitedthereto. For example, when the semiconductor 90 is made of a materialthat has a same carrier trap level density as that of the semiconductorlayer 50 or more, a similar advantage in the embodiment described aboveis obtained by forming the semiconductor layer 90 with a thickness in adirection perpendicular to the Z-direction more thinner than a thicknessof semiconductor layer 90 described in the second embodiment.

Third Embodiment

FIG. 18 is a schematic sectional view showing a non-volatile memorydevice 200 according to a third embodiment. FIG. 18 is a schematicsectional view of a memory cell array 6 of the non-volatile memorydevice 200.

The memory cell array 6 includes a plurality of stacked bodies 140arranged in the X-direction. The stacked body 140 includes a pluralityof word lines 20 and a select gate 30. A conductive layer (hereinafterback gate 120) is provided between the stacked body 140 and anunderlying layer 10 (not shown). The memory cell array 6 includes aninsulating film 23. The insulating film 23 electrically insulates theword lines 20, the select gate 30, and the back gate 120 from eachother.

The memory cell array 6 includes memory holes 71 and 72. For example,the memory holes 71 and 72 pierce in the Z-direction through the wordlines 20, the insulating film 23, and the select gate 30. The memoryholes 71 and 72 respectively pierce through the stacked bodies 140adjacent to each other in the X-direction. The lower end of the memoryholes 71 and 72 is located in the back gate 120. The memory holes 71 and72 are connected by a PC (pipe connection) 125 in the back gate 120.

A memory film 55, a semiconductor layer 110, and a core layer 113 arestacked in this order on the inner surface of the memory holes 71, 72and the PC 125. The memory film 55 is provided between each of the wordlines 20 and the semiconductor layer 110. In the memory hole 71, thememory film 55 may extend between the select gate 30 a and thesemiconductor layer 110. The memory film 55 can extend between theselect gate 30 b and the semiconductor layer 110. The core layer 113fills the inside of the memory holes 71, 72 and the PC 125.

The memory cell array 6 includes a memory cell MC located between thesemiconductor layer 110 and each of the word lines 20. The memory cellarray 6 includes select transistors ST1 and ST2 located respectivelybetween the semiconductor layer 110 and the select gate 30 a, andbetween the semiconductor layer 110 and the select gate 30 b. Thesemiconductor layer 110 includes a memory channel portion 110 a in theportion penetrating through each of the word lines 20. The semiconductorlayer 110 includes gate channel portions 110 b respectively in theportion piercing through the select gates 30 a and 30 b. Thesemiconductor layer 110 is electrically connected to a source line 65and a bit line 80 above the gate channel portions 110 b.

The gate channel portion 110 b has a thickness in the directionorthogonal to the Z-direction thinner than any part of the memorychannel portion 110 a. This can reduce the channel leakage current ofthe select transistor ST1 provided on the bit line 80 side and theselect transistor ST2 provided on the source line 65 side. In theembodiment, misselection and the like of the memory cell MC may beeffectively suppressed by improving the cutoff characteristics of theselect transistors ST1 and ST2 located at both ends of the memory stringprovided through the memory holes 71 and 72.

While certain embodiments have been described, these embodiments havebeen presented by way of example only, and are not intended to limit thescope of the inventions. Indeed, the novel embodiments described hereinmay be embodied in a variety of other forms; furthermore, variousomissions, substitutions and changes in the form of the embodimentsdescribed herein may be made without departing from the spirit of theinventions. The accompanying claims and their equivalents are intendedto cover such forms or modifications as would fall within the scope andspirit of the invention.

What is claimed is:
 1. A non-volatile memory device comprising: firstelectrodes stacked on an underlying layer; a second electrode providedon the first electrodes; a semiconductor layer extending in a firstdirection from the underlying layer to the second electrode, andincluding a first portion adjacent to the first electrodes and a secondportion adjacent to the second electrode; a memory film provided betweenat least one of the first electrodes and the semiconductor layer, thesecond portion having a thickness thinner than a thickness of the firstportion in a second direction perpendicular to the first direction; anda core layer adjacent to the semiconductor layer in the seconddirection, wherein the semiconductor layer is provided between the corelayer and each of the first electrodes, and between the core layer andthe second electrode.
 2. The device according to claim 1, furthercomprising: an insulating film provided between the first electrodes,and between one of the first electrodes and the second electrode in thefirst direction, wherein the insulating film is different in materialfrom the core layer.
 3. The device according to claim 1, wherein anupper surface of the core layer is located at a level in the firstdirection between an upper surface of the second electrode and an upperend of the semiconductor layer.
 4. The device according to claim 1,wherein the second electrode includes electrode layers stacked in thefirst direction, wherein part of the second portion adjacent to at leastone of the electrode layers has a thickness in the second direction thatis thinner than that of the first portion.
 5. A non-volatile memorydevice comprising: first electrodes stacked on an underlying layer, asecond electrode provided on the first electrodes; a semiconductor layerextending in a first direction from the underlying layer to the secondelectrode, and including a first portion adjacent to the firstelectrodes and a second portion adjacent to the second electrode; amemory film provided between at least one of the first electrodes andthe semiconductor layer; the second portion having a thickness thinnerthan a thickness of the first portion in a second directionperpendicular to the first direction; a third electrode provided betweenthe underlying layer and the first electrodes; a conductive layerprovided between the underlying layer and the third electrode; and awiring provided on the second electrode, wherein one end of thesemiconductor layer is electrically connected to the conductive layer,and the other end of the semiconductor layer is electrically connectedto the wiring.
 6. The device according to claim 5, wherein the memoryfilm extends between the second electrode and the semiconductor layer,and between the third electrode and the semiconductor layer.
 7. Thedevice according to claim 5, wherein the second electrode has athickness in the first direction thicker than that of each firstelectrode.
 8. The device according to claim 5, wherein part of the firstportion adjacent to the third electrode has a thickness in the seconddirection thicker than that of the second portion.
 9. A non-volatilememory device comprising: first electrodes stacked on a underlyinglayer; a second electrode provided on the first electrodes; a firstsemiconductor layer extending in a first direction from the underlyinglayer to the second electrode; a second semiconductor layer extending inthe first direction, and having a thickness in a second directionperpendicular to the first direction thinner than a thickness in thesecond direction of the first semiconductor layer, the secondsemiconductor layer being electrically connected to the firstsemiconductor layer; a memory film provided between at least one of thefirst electrodes and the first semiconductor layer; and a first corelayer adjacent to the second semiconductor layer in the seconddirection, wherein the second semiconductor layer includes a portionprovided between the first core layer and the second electrode.
 10. Thedevice according to claim 9, further comprising: a second core layeradjacent to the first semiconductor layer in the second direction. 11.The device according to claim 10, further comprising: a third electrodeprovided between the underlying layer and the first electrodes; aconductive layer provided between the underlying layer and the thirdelectrode; and a wiring provided on the second electrode, wherein thefirst semiconductor layer is electrically connected to the conductivelayer, and the second semiconductor layer is electrically connected tothe wiring.
 12. The device according to claim 11, wherein part of thefirst semiconductor layer adjacent to the third electrode has athickness in the second direction thicker than a thickness in the seconddirection of the second semiconductor layer.
 13. The device according toclaim 9, wherein the second semiconductor layer has a lower carrier traplevel density than that in the first semiconductor layer.
 14. The deviceaccording to claim 9, wherein the first semiconductor layer is a siliconlayer, and the second semiconductor layer is an oxide semiconductorlayer.
 15. The device according to claim 9, further comprising: a gateinsulating film placed between the second semiconductor layer and thesecond electrode, wherein the gate insulating film is different inmaterial from the memory film.